laser bonding meaning in Chinese

激光焊接
激光束焊接

Research advances in lasers bonded on silicon substrates
硅基键合激光器的研究进展
The three dimensional temperature distribution of laser bonding with a gaussian thermal source is modeled using the finite element method
摘要在硅玻璃激光键合中，温度场的分布是影响晶片能否键合的关键因素。
Finally , with regression analysis on the simulation results , a regression model is made and the optimal process parameters of laser bonding are found
然后通过漏选试验确定影响激光键合的主要工艺参数有激光功率、激光扫描速度及键合初始温度。
Then the key process parameters of laser bonding , including laser power , scanning velocity , and initial temperature , are obtained with the help of scanning experiments
运用该模型计算了不同的工艺参数条件下硅玻璃的温度场分布，并由此得出键合线宽。